01
Soldered hardware
Move from removable breadboards to solderable
prototyping board / perfboard with permanent,
shorter hard-wired connections.
This should eliminate much of the plastic and
connector height that currently contributes to
the device's thickness.
02
3D-printed shell
Design an enclosure around the actual component
dimensions instead of fitting components into a
manually built shell.
Display mounting, buttons, battery placement,
speaker openings, and internal supports can then
be designed as part of one system.
03
Evaluate Pico / Pico W
A future revision may compare the ESP32 with the
Raspberry Pi Pico family for I/O, memory,
performance, board layout, and software support.
Because wireless functionality is valuable to CAPY,
a Pico W-class platform would be the more direct
alternative if connectivity remains a requirement.
04
Deeper hardware
Longer-term CAPY development can expand into custom
peripherals, FPGA-based components, and increasingly
low-level digital hardware.
The goal is for CAPY to continue evolving alongside
my understanding of embedded systems and computer
architecture.
CAPY remains an active engineering project. Future
revisions will continue to document the problems,
decisions, and tradeoffs that shape the system.
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